CU4

Electro Optical Frame

Quality control of small objects

The CU4 is an easy to use, yet highly accurate and fast diameter measurement system. Conoptica’s unique model-based measurement algorithm offers a diameter measurement that is very robust against dirt and other disturbances in the drawing die.

 

Software

Drawing Die Diameter & Ovality
This module is a simplified version of the Drawing Die Profile. It will only provide diameter and ovality measurements, and is intended for systems without rotating axis.

Shaped Die Cross-section
This module is a simplified version of the Shaped Die Profile. It will only provide 2D measurements, and is intended for systems without dual rotating axis.

Wire, Pin & Needle
Fast and simple 2D measurement of wire samples, pins, needle angles etc. Useful for verification of grinding needle angles, sampling drawn wire and more.

X-Cut Section
For special applications, Conoptica offers the possibility to inspect cross-sections of various products, like shaped wire, rings, machined parts etc. This module is special in that it requires a special objective to be installed in the Conoptica measurement system. This objective is of type ‘Brightfield’, as opposed to the normal objectives used in the
CU11/CU6/CU4 systems. (The CU20 uses Brightfield technology only.)

Specifications

Diameter Range
Minimum diameter: 0.020 mm (0.00079 in)
Maximum diameter: 7.000 mm (0.27559 in)

Max Casing Size
Diameter: 55 mm (2.16 in)
Height: 30 mm (1.18 in)
Weight: 0.300 kg

Accuracy
Please contact us for accuracy details.

Tell us more about the CU4