The CU4 is an easy to use, yet highly accurate and fast diameter measurement system. Conoptica’s unique model-based measurement algorithm offers a diameter measurement that is very robust against dirt and other disturbances in the drawing die.
Drawing Die Diameter & Ovality
This module is a simplified version of the Drawing Die Profile. It will only provide diameter and ovality measurements, and is intended for systems without rotating axis.
Shaped Die Cross-section
This module is a simplified version of the Shaped Die Profile. It will only provide 2D measurements, and is intended for systems without dual rotating axis.
Wire, Pin & Needle
Fast and simple 2D measurement of wire samples, pins, needle angles etc. Useful for verification of grinding needle angles, sampling drawn wire and more.
For special applications, Conoptica offers the possibility to inspect cross-sections of various products, like shaped wire, rings, machined parts etc. This module is special in that it requires a special objective to be installed in the Conoptica measurement system. This objective is of type ‘Brightfield’, as opposed to the normal objectives used in the
CU11/CU6/CU4 systems. (The CU20 uses Brightfield technology only.)
Minimum diameter: 0.020 mm (0.00079 in)
Maximum diameter: 7.000 mm (0.27559 in)
Max Casing Size
Diameter: 55 mm (2.16 in)
Height: 30 mm (1.18 in)
Weight: 0.300 kg
Please contact us for accuracy details.