Other Applications

Software applications for special needs

The Conoptica systems are mainly used for measuring round or shaped Drawing Dies. In addition we offer some more specialized applications for our users with specific requirements

Enameling Die

Specially adapted to measure the typical geometry of enameling dies, this module is useful for accurate 2D and 3D measurements of such dies.

Wire, Pin & Needle

Fast and simple 2D measurement of wire samples, pins, needle angles etc. Useful for verification of grinding needle angles, sampling drawn wire and more.

X-Cut Section

For special applications, Conoptica offers the possibility to inspect cross-sections of various products, like shaped wire, rings, machined parts etc. This module is special in that it requires a special objective to be installed in the Conoptica measurement system. This objective is of type ‘Brightfield’, as opposed to the normal objectives used in the CU11/CU6/CU4 systems. (The CU20 uses Brightfield technology only.)

 

Software Applications and Compatible Systems

CU4

2D Measurement
  • Enameling Die

CU6-series

3D Measurement
  • Enameling Die
  • Wire, Pin & Needle

CU11-series

3D Measurement
  • Enameling Die
  • Wire, Pin & Needle
  • X-Cut Section (with Brightfield Objective)

CU20

3D Measurement
  • Enameling Die
  • Wire, Pin & Needle
  • X-Cut Section

Tell us more about these specialized applications: