Specially adapted to measure the typical geometry of enameling dies, this module is useful for accurate 2D and 3D measurements of such dies.
Fast and simple 2D measurement of wire samples, pins, needle angles etc. Useful for verification of grinding needle angles, sampling drawn wire and more.
For special applications, Conoptica offers the possibility to inspect cross-sections of various products, like shaped wire, rings, machined parts etc. This module is special in that it requires a special objective to be installed in the Conoptica measurement system. This objective is of type ‘Brightfield’, as opposed to the normal objectives used in the CU11/CU6/CU4 systems. (The CU20 uses Brightfield technology only.)